Grinding Wheels for Ceramic Materials in Packaging

Name: Grinding Wheels for Ceramic Materials in Packaging
Description: This product is mainly used for the grinding of alumina or silicon carbide electronic component ceramic packaging materials, both for flat or outer circle grinding. It can also be used for grinding outer circles or flat surfaces of hard alloys. The product features high grinding efficiency, excellent workpiece surface quality, and long service life.

Shape Name/CodeOuter Diameter (D)Total Thickness (T)Abrasive Layer Width (K)Abrasive Layer Thickness (X)
Parallel Wheel / 9A13005-40105-40
3507.5
40010
45010

Note: Customization can be achieved based on the type of equipment used.