Semiconductor Wafer Grinding and Polishing Materials Description: This category includes grinding liquids, emulsifiers (oil-based/water-based), and polishing liquids (cerium oxide CeO2, green silicon carbide GC, diamond powder) (diamond slurry, alumina Al2O3 slurry, silica SiO2 slurry). These materials are primarily used for precision grinding and polishing of optical glass, sapphire, silicon wafers, silicon carbide wafers, and other materials.
